| Jobs | Category | Work place | Release Date | Operation |
|---|
| AI Algorithm Engineer – Model Alignment & Knowledge Base | Technology | Shenzhen | 2026-08-10 | View Details |
1.Responsible for building AI agent-based automated debugging capabilities for motor control programs: for customers' actual motors and operating conditions, realize automated parameter configuration generation, motor parameter identification, loop tuning, and abnormal fault localization, replacing the current manual experience-dependent debugging process.
2.Responsible for reliability testing of motor control programs: build automated test cases and regression systems covering abnormal conditions such as startup, locked-rotor, overcurrent, undervoltage, and temperature rise, output reliability verification reports, and ensure customer programs are fully validated before mass production.
3.Responsible for end-to-end process integration based on customer on-site needs: investigate customer pain points in development and production line stages, integrate agents with knowledge bases, debugging toolchains, and test fixtures, and deliver a complete closed-loop solution directly usable by customers.
4.Responsible for coordinating with algorithm teams, completing effectiveness validation and issue localization of model optimization results and knowledge bases in real-world scenarios, feeding back various engineering issues encountered in industrial and motor control application scenarios, driving model and knowledge base iteration, and consolidating best practices and delivery standards.
1.Majors: Electrical Engineering and Automation, Automation, Control Science and Engineering, Electronic Information Engineering, Electronic Science and Technology, Microelectronics Science and Engineering, Mechatronic Engineering, Computer Science and Technology, Artificial Intelligence, Software Engineering, or related fields.
2.Bachelor's degree or above.
| Advanced AI Deployment Engineer | Technology | Shenzhen | 2026-08-10 | View Details |
1. Responsible for AI algorithm research and model pre-research related to industrial control and motor drive, complete neural network model design, reinforcement training and iterative optimization to improve algorithm accuracy and stability on chip terminals.
2. Responsible for building industrial technical knowledge base, sorting out technical data of chip application, packaging process, test exceptions, EMC rectification and mass production problems, and completing data cleaning, labeling and structured precipitation.
3. Responsible for algorithm model deployment and adaptation, optimize model lightweighting according to MCU/ASIC chip computing power characteristics, and solve practical problems such as low yield and poor scenario adaptation in engineering implementation.
4. Responsible for compiling and updating algorithm technical documents, model training reports and knowledge base manuals, and continuously summarizing algorithm best practices to support product iteration and technical innovation.
1.Majors: AI, Computer Science, Data Science, Mathematics, Electronic Information, Software Engineering, Automation, or related fields.
2.Bachelor's degree or above.
| Quality Engineer | Technology | Shenzhen | 2026-07-28 | View Details |
1.Responsible for compliance inspection of internal quality documents within the department.
2.Responsible for retention, safekeeping and traceability of company quality records.
3.Responsible for management of production‑related documents including bonding diagrams, marking drawings, production flow charts and PCB manufacturing files.
4.Responsible for promoting the company’s engineering change management activities.
1.Majors: Electronics Packaging, EE, Automation, etc.
2.Bachelor's degree or above.
| NPI Engineer | Operation | Shenzhen | 2026-07-28 | View Details |
1.Responsible for the introduction and evaluation of packaging, process technology and test for new products.
2.Conduct technical communication with packaging foundries to formulate assembly design rules, and assist R&D in defining packaging information for new products.
3.Act as the technical interface for test houses and packaging foundries; be responsible for the confirmation, conversion, internal approval, maintenance and management of technical documents including bonding diagrams, marking drawings and packaging specifications.
4.Provide probe‑card requirements and test specifications for CP/FT tests, and serve as the interface between R&D and production suppliers.
5.Confirm and maintain product packaging BOM and ERP engineering documents, as well as manage environmental compliance documents accordingly.
1.Majors: Power Electronics, EE, CS, etc.
2.Bachelor's degree or above.
| ATE Test Engineer | Operation | Shenzhen | 2026-07-28 | View Details |
1. Participate in ATE test solution development for chips, power devices, IPM modules and sensors, build automatic test platforms, and develop test programs and standard test procedures.
2. Conduct ATE automatic tests including electrical parameters, functions, reliability, switching characteristics and power cycling. Complete data analysis and problem screening to ensure test accuracy and coverage.
3. Support pilot and mass production testing, locate test abnormalities and yield fluctuations, and cooperate with process, packaging and R&D teams to troubleshoot and close quality issues.
4. Summarize test methods and best practices, optimize test programs and testing efficiency, and compile test specifications and technical reports to support mass production and customer delivery.
1.Majors: Power Electronics, EE, CS, etc.
2.Bachelor's degree or above.
| Planning Engineer | Operation | Shenzhen | 2026-07-28 | View Details |
1.Assist department managers in business negotiation with manufacturers to obtain competitive price, quality and service.
2.Based on sales forecast, inventory, procurement lead‑time, production scheduling, capacity and customer demand, assist in preparing monthly production, material return and delivery plans, identify supply risks and report in advance.
3.Support ERP material requirement calculation, procurement demand accounting and submit purchase order application.
4.Assist in issuing outsourcing and purchase orders to suppliers, and monitor production progress of manufacturers.
1.Majors: Power Electronics, EE, CS, etc.
2.Bachelor's degree or above.
| Overseas Technical Support Engineer | Technology | Shenzhen,Qingdao,Foshan,Hefei,Hangzhou,Overseas | 2026-07-28 | View Details |
1. Communicate with overseas customers and distributors, and provide full technical support for chips, power devices, IPM modules, sensors and motor drivers, including solution selection and application implementation.
2. Assist in troubleshooting technical issues in chip design, software and hardware debugging, reliability testing, EMC rectification, pilot production, mass production and product certification, and drive problem closed-loop resolution.
3. Follow up the full product development process including requirement definition, design, verification, packaging and process iteration, provide technical evaluation suggestions, and assist R&D in product and process optimization.
4. Deliver overseas technical training, maintain and update datasheets, application notes and technical documents, summarize technical cases and best practices, and continuously improve customer application stability and product performance.
1.Majors: Instrumentation, EE, Automation, Power Electronics, etc.
2.Fluent English, willing to travel overseas, customer-oriented.
3.Bachelor's degree or above.
| Embedded Development Engineer | Technology | Shenzhen,Qingdao,Foshan,Hefei,Hangzhou | 2026-07-28 | View Details |
1.Assist in device selection, schematic and PCB design for customer solutions, participate in development and debugging of product DEMO boards, and take part in EMC design and rectification for motor drivers.
2.Participate in new‑product specification definition, function and performance testing, assist in MCU/ASIC test software development, and conduct project requirement analysis and solution design.
3.Support customer technical support, resolve technical issues in customer development, debugging, pilot production and certification, and deliver technical training.
4.Compile technical documents such as chip datasheets and application notes, accumulate project experience and summarize development best practices.
1.Majors: Instrumentation, EE, Automation, Power Electronics, Communications, Mechanical, Motor, etc.
2.Bachelor's degree or above.
| Hardware Engineer | Technology | Shenzhen,Qingdao,Foshan,Hefei,Hangzhou,Overseas | 2026-07-28 | View Details |
1.Assist in device selection, schematic design and PCB design for customer solution projects.
2.Participate in the design, development and debugging of product DEMO boards.
3.Support customer technical support, and resolve technical issues during product development, debugging, mass production and certification.
4.Participate in EMC design and rectification for motors and drivers.
5.Accumulate technical experience and summarize project best practices.
1.Majors: Instrumentation, EE, Automation, Power Electronics, Communications, Mechanical, Motor, etc.
2.Bachelor’s degree or above.
| Application Engineer | Technology | Shenzhen,Qingdao,Foshan,Hefei,Hangzhou,Overseas | 2026-07-28 | View Details |
1.Participate in new product specification definition and assist in product function and performance testing.
2.Assist in the design, debugging and verification of new product demonstration boards.
3.Support on-site technical support and training for customers and distributors.
4.Participate in project requirement analysis and scheme design.
5.Assist in compiling chip datasheets, user guides and application notes.
6.Assist in improving laboratory rules and management systems.
1.Majors: Instrumentation, EE, Automation, Power Electronics, Communications, Mechanical, Motor, etc.
2.Bachelor’s degree or above
| Software Engineer | Technology | Shenzhen | 2026-07-28 | View Details |
1.Participate in the development of test software for MCU/ASIC projects.
2.Assist in the delivery and deployment of MCU/ASIC test software.
3.Support the development and maintenance of IDE sub-modules including editor, compiler and debugger, implement new functions based on user requirements, and resolve user feedback issues.
4.Assist in sorting out software requirements and compiling software specification documents.
1.Majors: CS, Software Eng.
2.Bachelor’s degree or above
| Sensor Application Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
1.Participate in sensor design scheme formulation, and assist in scheme evaluation from technical feasibility, innovation and cost‑efficiency perspectives.
2.Assist in sensor principle design, support sensor principle selection and parameter definition of sensing and conversion components.
3.Take part in sensor structural design, consider mechanical stability, package form and size constraints to guarantee reliable operation under target environment.
4.Assist in circuit design, support matching between sensor elements and signal‑processing circuits to realize high‑precision signal acquisition and conversion.
1.Majors: Instrumentation, EE, Automation, Power Electronics, etc.
2.Matserr’s degree or above
| Motor Control Algorithm Engineer | Technology | Shenzhen,Qingdao,Foshan,Hefei,Hangzhou,Overseas | 2026-07-28 | View Details |
1. Participate in motor driver algorithm pre-research, algorithm development and program architecture design.
2. Assist in driver algorithm analysis, comparison and troubleshooting.
3. Support technical problem solving for chip product customer application issues.
4. Assist in compiling chip datasheets, user manuals and application notes.
1.Majors: Control Theory, Power Electronics, Automation.
2.Master’s degree or above.
| Packaging R&D Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
1. Participate in the introduction of new packaging technologies and processes, and assist in packaging feasibility evaluation for new products to select mass-producible and reliable packaging solutions.
2. Cooperate with packaging vendors to sort out assembly design rules, assist in defining new product packaging specifications, and support packaging form evaluation and process introduction.
3. Serve as a technical interface with packaging foundries, and assist in confirming and maintaining technical documents such as assembly drawings, marking drawings and packaging specifications.
4. Assist in the confirmation and maintenance of packaging BOM and environmental compliance documents, participate in the review of BOM, BD drawings and marking drawings, and support process report writing as well as material and equipment evaluation.
1.Majors: Microelectronics, Materials, IC Design, Mechatronics, etc.
2.Bachelor’s degree or above.
| IPM R&D Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
1. Participate in IPM product requirement and architecture review, and assist in design optimization to ensure manufacturability, testability and reliability.
2. Assist in device selection, BOM design and simulation verification of IPM modules.
3. Cooperate with the packaging team on module layout, process design and thermal optimization to improve product reliability.
4. Participate in functional and reliability tests of IPM modules, sort out test data and complete test reports.
5. Assist in tracking and solving technical problems during pilot production and mass production.
6. Collect customer application feedback and assist in optimizing product performance and stability.
1.Majors: IC, Electronics, Microelectronics, EE.
2.Bachelor’s degree or above.
| Layout Design Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
1. Execute physical implementation tasks for chip development.
2. Organize and participate in project and technical reviews, and take accountability for review conclusions.
3. Accumulate technical know-how and summarize development best practices.
4. Participate in the formulation and optimization of R&D processes, as well as the drafting and revision of technical document templates.
1.Majors: IC, Electronics, Microelectronics, EE.
2.Bachelor’s degree or above
| Power Device Design Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
1.Execute all specific R&D tasks during power device development.
2.Organize and participate in project and technical reviews, and take accountability for review conclusions.
3.Accumulate technical experience and consolidate R&D best practices.
4.Engage in the formulation and optimization of R&D processes, as well as the compilation and revision of various document templates.
1.Majors: IC, Electronics, Microelectronics, EE.
2.Bachelor’s degree or above.
| Digital Verification Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
1. Analyze and sort out chip product functional requirements, and clarify verification requirements and goals.
2. Conduct pre-project research, including technical feasibility analysis, IP retrieval, and technical evaluation and selection of outsourcing manufacturers to ensure technical compliance and feasibility of projects.
3. Identify core key technologies and difficulties in digital verification, carry out technical research, accumulate verification technologies and methodologies, and improve verification quality and efficiency.
4. Participate in project and technical reviews, deliver professional review comments, follow up and close problem rectifications, and take charge of verification quality and project progress.
1.Majors: IC, Electronics, Microelectronics, EE.
2.Master’s degree or above
| Digital IC Design Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
1.Responsible for analyzing and organizing product requirements.
2.Responsible for various tasks including product technical feasibility analysis, intellectual property search, and technical evaluation of outsourcing vendors.
3.Responsible for identifying key digital technologies and conducting R&D tackling of technical challenges.
4.Responsible for refinement and analysis of digital circuits within product specifications.
5.Responsible for digital circuit module partitioning and system solution design.
1.Majors: IC, Electronics, Microelectronics, EE.
2.Master’s degree or above
| Analog IC Design Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
1.Execute specific tasks for the analog portion during chip product development.
2.Organize and participate in project reviews and technical reviews, and take accountability for review conclusions.
3.Build technical know‑how and establish best practices.
4.Participate in formulating and optimizing R&D processes, as well as drafting and revising various document templates.
1.Majors: IC, Electronics, Microelectronics, EE.
2.Master’s degree or above
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